Satellite transmitter system

ABSTRACT

A satellite transmitter module for accepting input signals and emitting output signals for uplink transmission. The module includes a transmitter unit that includes i) transmitter circuitry, ii) at least one input port, iii) and at least one output port. At least one heat sink coupled to the transmitter unit includes a plurality of heat sink fins, wherein at least two of the plurality of heat sink fins are of different heights. A fan is capable of generating air flow parallel with the plurality of heat sink fins. The module further includes an outer enclosure that i) encloses the transmitter unit and the plurality of heat sink fins and ii) is impermeable to the air flow generated by the fan. The outer enclosure includes an enclosure cross section shape that is substantially similar to the at least one heat sink cross section shape defined by the height of each of the plurality of the heat sink fins.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. Nonprovisionalpatent application Ser. No. 15/068,484, filed on Mar. 11, 2016, whichfurther claims priority to a provisional application Ser. No.62/132,941, filed on Mar. 13, 2015, which are incorporated by referencein their entirety herein.

FIELD OF INVENTION

This disclosure generally relates to a satellite transmitter system, andmore specifically, to a satellite transmitter system that includes atransmitter module capable of more efficiently dissipating heat.

BACKGROUND

Terrestrial satellite transmitter systems are used for uplink signaltransmissions in satellite communications. Generally, a satellitetransmitter system includes an upconverter module that converts lowerfrequency modem data signals into higher frequency signals for an uplinksignal transmission to a satellite and/or a power amplifier to increasethe power of these higher frequency signals to levels adequate to reachthe distant satellite with sufficient strength. Moreover, thesetransmitters are often referred to as a block upconverter (BUC) in thesatellite communications industry, despite of the presence or absence ofa power amplifier. This block upconverter is generally coupled with anorthogonal mode transducer that faces a parabolic reflector dish that isdirected towards a specific satellite. Many times these blockupconverters are used in portable satellite uplink systems. Furthermore,because conventional transmitter modules are constructed with manyoff-the-shelf components (i.e., a upconverter module, a power amplifier,a power supply, etc.), the casing and the chassis of a conventionaltransmitter module must be sufficiently large to house eachoff-the-shelf component. As a result, conventional transmitter modulesinclude a rectangular (or square) cross sectioned form factor and areextremely heavy and cumbersome to carry and to set up, especially foruse out in the field.

As consumers demand more data-rich media, satellite transmittermanufacturers are continually upgrading their products to handle higheruplink data-rate communication. However, in order to achieve thesehigher uplink data rates, the power requirements for uplink data signaltransmission increases, together with the heat produced by thetransmitter circuitry (e.g., a microwave power amplifier) areconsiderable. As these power levels increase, the conventionaltransmitter block upconverter modules with rectangular or square crosssections continue to grow, resulting in very large and heavy units thatare inefficient at properly dissipating heat from the transmittercircuitry.

In addition to the demand for higher-power satellite transmitterscapable of delivering higher data rates, consumers are also demandingthat these transmitters be portable for mobile and quick-deployapplications. The importance of reducing the satellite transmitter'ssize and weight cannot be overstated for these portable applications.

Conventional satellite uplink transmitters include heat sinks with heatsink fins of equal height that are uniformly distributed across thesurface area of the unit regardless of the location of the fins relativeto the areas of greatest heat dissipation, resulting in a square orrectangular cross section. These heat sink fins of equal height utilizedwithin a conventional transmitter block dissipate heat extremelyinefficiently with regard to their size and weight, because the heatsink fins located at the areas of greatest heat levels generated by thetransmitter circuitry are of the same height as the heat sink finslocated at the lowest heat levels. These underutilized heat sink finsfurthest from the areas of greatest heat levels add unnecessary weightand size to the overall block transmitter. This extra weight and size ofthese underutilized heat sink fins leads to higher material costs tobuild a conventional block transmitter and detracts from the portabilityof the unit.

Furthermore, because most air fans include rotating fan blades that forma circular cross section, managing the air flow within a rectangularcross section of a transmitter coupled with a circular cross sectionedair fan or fans is difficult and more costly. For example, using acircular fan that includes circular vanes and fan blades that form acircular cross section coupled with a rectangular-cross-sectiontransmitter may lead to air flow distribution issues, air pressuredifferential issues, etc. To mitigate these issues and interface boththe rectangular cross sectioned transmitter with the circular crosssectioned air fan, conventional transmitter designers have included aplenum chamber (i.e., an empty chamber) to help equalize air pressurewithin the unit for more even distribution of air flow. A similar issueoccurs when using a row of several circular fans; a pressure-equalizingplenum is needed to ensure proper airflow across the heat sinking fins.However, utilizing one or more plenum, again, adds weight and volume tothe transmitter unit.

SUMMARY

A satellite uplink transmitter module for transmitting signals foruplink signal transmission in a satellite communication system includesa transmitter unit that includes i) transmitter circuitry, ii) an inputsignal port, iii) and a transmit output signal port, the transmittercircuitry generating heat. The transmitter circuitry may containfrequency conversion circuitry to convert from a typicallylower-frequency modem signal to a typically higher-frequency radiofrequency (RF) satellite uplink signal. The transmitter circuitry mayalso contain amplification circuitry to increase the typicallylower-power input signal to a higher-power output signal suitable forcommunication with a distant satellite. The satellite uplink transmittermodule also includes at least one heat sink coupled to the transmitterunit, the at least one heat sink including a plurality of heat sinkfins, wherein at least two of the plurality of heat sink fins are ofdifferent heights and an air fan capable of generating air flow parallelwith the heat sink fins. The satellite uplink transmitter moduleincludes an outer enclosure that i) encloses the transmitter unit andthe plurality of heat sink fins and ii) is impermeable to the air flowgenerated by the air fan, the outer enclosure including an enclosurecross section shape that is substantially similar to a heat sink crosssection shape that is defined by the height of each of the plurality ofthe heat sink fins.

According to one embodiment of the invention, a satellite transmittermodule accepts input signals and emits output signals for uplinktransmission in a satellite communication system. A transmitter unitincludes i) a transmitter circuitry, ii) at least one input port, iii)and at least one output port. At least one heat sink is coupled to thetransmitter unit. The at least one heat sink includes a plurality ofheat sink fins, wherein at least two of the plurality of heat sink finsare of different heights. The at least one heat sink is positioned in aclose proximity to the transmitter circuitry for dissipating heatgenerated from the transmitter circuitry. A fan generates air flowsubstantially parallel with spaces between the plurality of heat sinkfins. An outer enclosure i) encloses the transmitter unit and theplurality of heat sink fins therein and ii) is impermeable to the airflow generated by the fan. The outer enclosure includes a cross sectionshape substantially similar to a contour of the at least one heat sinkcross section shape defined by the heights of the plurality of the heatsink fins.

According to another embodiment, a satellite transmitter module acceptsinput signals and emits output signals for uplink transmission in asatellite communication system. The satellite communication systemincludes a transmitter that includes a transmitter circuitry fortransmitting a suitable satellite communications signal. At least oneheat sink is thermally coupled to the transmitter. The at least one heatsink includes a plurality of heat sink fins, wherein at least two of theplurality of heat sink fins comprise heights as a function of a distancebetween the plurality of heat sink fins and the transmitter. The atleast one heat sink is positioned in a close proximity to thetransmitter for dissipating thermal energy generated from thetransmitter. A fan, disposed at a distal end of the transmitter,generates air flow substantially parallel with spaces between theplurality of heat sink fins. An outer enclosure i) encloses thetransmitter and the plurality of heat sink fins therein.

According to a further embodiment of the invention, a manufacturingprocess or method reduces thermal energy in a satellite transmittermodule. The process includes connecting a plurality of heat sink fins toa transmitter. The transmitter transmits a suitable satellitecommunications signal and generates thermal energy. Each of theplurality of heat sink fins includes a height, wherein at least twoheights being determined as a function of a distance between the each ofthe plurality of the heat sink fins and the transmitter. The processfurther includes generating air flow substantially parallel with spacesbetween the plurality of heat sink fins via a fan. The method alsoincludes enclosing the plurality of heat sink fins and the transmitterin a housing. The housing includes a cross section shape defined by theheight of each of the plurality of heat sink fins.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 depicts an exemplary prior art satellite uplink transmittermodule with square or rectangular cross section that includes a securedouter enclosure that encloses a transmitter unit and heat sink(s)according to one embodiment of the invention.

FIG. 2 depicts an exemplary satellite uplink transmitter module thatincludes a secured outer enclosure that encloses a transmitter unit andheat sink(s) according to one embodiment of the invention.

FIG. 3 illustrates an exploded diagram of an exemplary satellite uplinktransmitter module that includes an outer enclosure, a transmitter unit,heat sink(s), and a fan according to one embodiment of the invention.

FIG. 4 depicts an exemplary satellite uplink transmitter module wherethe heat sinking fins and matching outer enclosure have an octagonalshape according to one embodiment of the invention.

FIG. 5 depicts an exemplary satellite uplink transmitter module wherethe heat sinking fins and matching outer enclosure have arounded-corner-rectangular shape according to one embodiment of theinvention.

FIG. 6 depicts an exemplary satellite uplink transmitter module wherethe heat sinking fins and matching outer enclosure have an ellipticalshape according to one embodiment of the invention.

FIG. 7 depicts a heat sink including a plurality of heat sink fins foruse in an exemplary satellite uplink transmitter module according to oneembodiment of the invention.

FIG. 8a illustrates a simulated thermal performance of an exemplarytransmitter heat sink with a rounded cross section, according to oneembodiment of the invention.

FIG. 8b illustrates a simulated thermal performance of an exemplaryconventional transmitter heat sink with a rectangular cross sectionaccording to one embodiment of the invention.

Corresponding reference characters indicate corresponding partsthroughout the drawings.

DETAILED DESCRIPTION

Generally speaking, a satellite transmitter system includes atransmitter module that, via its rounded form factor, more efficientlydissipates high levels of heat that is generated while converting andamplifying lower frequency and lower power data signals into higherfrequency and higher power satellite transmission signals (i.e.,“upconverting” and “amplifying”). For example, the uplink transmittermodule may be coupled with a rounded cross sectioned fan that allows formore even and optimized airflow distribution (i.e., better heatdissipation) within the rounded form factor of the transmitter module.Moreover, the transmitter module may include one or more heat sinkscoupled to a transmitter unit that processes frequency conversions andamplifications, generating the high levels of heat. Importantly, eachheat sink may include a plurality of heat sink fins, and depending onthe heat level generated at particular location of the transmitter unit,a differently sized heat sink fin may be employed at that particularlocation associated with the transmitter unit. For example, the highestlevel of heat of the transmitter unit within the transmitter module maybe generated along a longitudinal central axis of the transmitter unit.To properly dissipate this high level of heat, a heat sink fin with aheight higher than all other heat sink fins may be located along thecentral axis of the transmitter unit. Other heat sink fins not locatedon the central axis of the transmitter unit may be shorter than thoselocated along the central axis because the heat dissipation requirementsassociated with these other locations not on the central axis of thetransmitter unit are lower. As result, the more streamlined andoptimized airflow in conjunction with the differently sized heat sinkfins allows more efficient (in terms of heat sink volume and mass) heatdissipation from the transmitter unit within the transmitter module.

Advantageously, this exemplary configuration of the transmitter systemallows for more optimized heat dissipation, better internal air flow,better external aerodynamics (i.e., high wind conditions), better solarreflecting, and, importantly, a lighter-weight and lower-volumetransmitter module. For example, interfacing a rounded cross sectionedfan (i.e., rotating fan blades) with a round cross section transmittermodule better equalizes air pressure internal to the transmitter moduleand reduces wasted or turbulent air flow present in a rectangular crosssectioned transmitter. Furthermore, in utilizing a rounded crosssectioned fan in conjunction with the round cross sectioned transmittermodule, there is no need for a plenum chamber (and its associated weightand size requirements) to assist in evenly distributing air flow withinthe transmitter module, further reducing the size and weight of thetransmitter module.

Moreover, a rounded cross section transmitter module weighs less and issmaller in size relative to a rectangular cross section transmitterbecause the rounded cross sectioned transmitter module lacks corners(i.e., uses less material) and may include heat sink fins that areshorter (i.e., uses less material) at locations on the transmitter unitthat are laterally further away from the longitudinal central axis ofthe transmitter module. For example, the cross section area of acircular cross sectioned transmitter module is roughly 21% smallercompared to the cross section area a square cross sectioned transmitter.In this example, if each heat sink fin was sized according to the crosssection of each respective transmitter module, the circular crosssectioned transmitter module uses roughly 21% less heat sink finmaterial and is 21% less in mass compared to the square cross sectionedtransmitter. These size and weight reductions are especially importantin portable satellite communications systems.

FIG. 1 illustrates a prior art satellite transmitter module typical ofwhat is offered in the industry. As shown in FIG. 1, the fully assembledsatellite transmitter module 100 may include an outer enclosure 101, atransmitter unit 102, one or more fans 103, and one or more heat sinks104 that are coupled to the transmitter unit. In this conventionalapproach, the heat sinks comprise several fins, which are all of thesame height. This results in the satellite transmitter module having asubstantially rectangular (including square) cross sectional shape. Thisshape, as has been discussed previously, is not the most efficient forheat removal as it results in excess size and weight due to theoversized heat sinking fins in areas of low power dissipation as well asoften requiring a plenum chamber 105 to assist in the airflowdistribution.

FIG. 2 illustrates a satellite transmitter module 200 that may beintegrated into an indoor or an outdoor satellite transmitter systemaccording to one embodiment of the invention. As shown in FIG. 2, afully assembled satellite transmitter module 200 may include an outerenclosure 201, a transmitter unit 202, one or more fans 203, and one ormore heat sinks 204 that are coupled to the transmitter unit 202. Afully assembled satellite transmitter module 200, as shown in FIG. 2,may include a circular (or substantially circular, ellipsoidal,octagonal, or any other substantially rounded shape) form factor. Theouter enclosure 201 (or a shell, a shroud, a housing, etc.) may encasethe other transmitter components of the module 200, and as shown in FIG.2. For example, the enclosure 201 may include two rounded shroud piecesfastened together (e.g., using screws or bolts, as shown in FIG. 2, orany other suitable manner to fasten two pieces of the enclosure securelytogether.) The enclosure 201 may assist in protecting and/orstructurally supporting the rest of the transmitter module 200.Alternatively, the enclosure 201 may include three or more piecesfastened together or even one solid piece that may be removable from theother transmitter components of the transmitter module 200. The two openends of the transmitter module 200, while not covered by the enclosure201 as shown in FIG. 2, may alternatively be encased or covered by theenclosure 201 as well.

With continued reference to FIG. 2, the transmitter module 200 mayfurther include one or more input ports 205, such as a power input port,a modem data input port, a control/monitor signal input (and/or output)port, a controller input, a local oscillator/clock input port, etc. andone or more output ports 206 (e.g., a radio frequency (RF) output port,a monitor output port, etc.) that are exposed and accessible while theenclosure is affixed, attached, or coupled to the transmitter unit 202.These input ports 205 and output ports 206 may be visible or accessiblewhen the enclosure is coupled to the other transmitter components. Thedata input port may accept low frequency input signals in the range of1-2 GHz, for example, and may include any type of interface, such as acoaxial cable, waveguide, etc. The monitor/control input and/or outputmay be implemented with a RS-232 serial communication protocol, or anyother suitable protocol.

FIG. 3 illustrates an exploded diagram of the transmitter module 200 ofFIG. 2, revealing the transmitter components encased by the enclosure201. As shown in FIG. 3, a fan or fans 203 may be housed within theenclosure 201 and may include a circular cross section, as defined bythe shape of the rotating fan blades. This fan may force air fromoutside the enclosure along or through the one or more heat sinks 204coupled to the transmitter unit 202. The transmitter unit 202 containstransmitter circuitry, which may include a frequency converter, a powercombiner, a power amplifier (e.g, a microwave power amplifier), a powersupply, any other suitable subsystem unit utilized in transmitting asuitable satellite communications signal, or a combination thereof. Inan alternative embodiment, an externally located upconverter module maybe communicatively coupled to the transmitter module 200 that includesthe power amplifier. In this alternative embodiment, the transmittermodule 200 may receive the higher frequency upconverted signal from theexternal upconverter module, and the power amplifier within thetransmitter module may amplify the upconverted signal for satellitetransmission. Moreover, while depicted in FIG. 3 as substantiallyrectangular in shape, the transmitter unit 202 may be rounded,elliptical, triangular, or any other shape desired. Importantly, thelocation and the cross section of the heat sinks 204 and the locationand size of each heat sinks' respective heat sink fins determines theefficiency of heat dissipation and the overall thermal performance ofthe transmitter module 202, while minimizing its size and weight. Forexample, as shown in FIG. 3, one configuration may include one heat sink204 a coupled to the top of the transmitter unit and one heat sink 204 bcoupled to the bottom of the transmitter unit 202. The transmittermodule 200 is not limited to only two heat sinks; any number of heatsinks may be coupled to or integrated with the upconverter unit. It isalso to be understood that the cross section shape of the heat sink finson one side of the transmitter unit 202 needs not to be the same orsubstantially identical as the other side of the transmitter unit 202.

Continuing with this example, each heat sink includes a number of heatsink fins of different heights or sizes (210-212). As illustrated inFIG. 3, for example, each of these heat sink fins are positioned inparallel with each other despite each heat sink fin being of a differentheight. However, each heat sink fin need not be position in parallelwith each other, but alternatively, each heat fin may be position in anoutward radial manner from the transmitter unit 202, in a fractalpattern structure, in a lattice structure, or any other suitable heatsink fin design structure that is capable of dissipating heat through alarge surface area to volume ratio. For example, the height or length ofthe heat sink fins extending away from the transmitter circuitry may bea function of a distance of the heat sink fins therefrom.

Moreover, each heat sink fin may run longitudinally (i.e., in thedirection of air flow) for the entire length or a portion of the lengthof the transmitter module. Additionally, each heat sink fin may be partof one heat sink 204 (i.e., the heat sink includes a plate that eachheat sink fin may be attached or affixed to) or each heat sink fin maybe attached or affixed to the chassis or enclosure of the transmitterunit 202. For example, each heat sink fin 204 may be thermally coupledto the transmitter circuitry 202. Furthermore, each heat sink fin maycomprise heat pipes, dimples, or other features to aid in dissipatingthe heat generated by the transmitter unit 202.

Moreover, based on the design of the heat sink fins according to aspectsof the invention, the spacing between the apex or the outer edge of eachof the heat sink fins and the interior of the enclosure 201 may bereduced to a minimum. For example, as shown in FIG. 1 in the prior art,the rectangular shape of the transmitter module enables more interiorvolume of air within its casing. This creates a bigger volume of airinside to assist dissipation of heat. However, such a design introducesproblems in its overall size. Embodiments of the invention solve theproblem elegantly: increase heat dissipation efficiency while reducewasted space of the design.

With continued reference to FIG. 3, the height or the size of each heatsink fin (210-212) may be determined based on the relative locationrelationship of a particular heat sink fin with respect to heatgenerating regions of the transmitter unit. As a result, the pluralityof heat sink fins may together form a particular cross section shape.For example, as shown in FIG. 3, the heat sink fins (201-212) on the topand on the bottom of the transmitter unit 202 both form a rounded,circular cross section. In this example, this circular cross sectionshape indicates that the most heat is generated along the longitudinalcentral axis of the transmitter unit 202 because the heat sink fins withthe most height 210 are located along the central axis of thetransmitter unit 202. Conversely, the heat sink fins with the leastheight 212, in this example, are found along edges (i.e., furtherdistance from the central axis) of the transmitter unit.

Any type of cross section shape of the heat sink fins 210-212 may beemployed to optimally dissipate heat based on the heat generated by aparticular transmitter unit 202. For example, the cross section may behexagonal, octagonal, elliptical, or any other suitable cross sectionshape. For example, FIG. 4 shows an alternative embodiment where thecross section is essentially octagonal. This end view figure shows thatthe heat sink 204 and its corresponding heat sink fins (210-212) have anoctagonal cross section, with the outer enclosure 201 conforming to thisoctagonal shape. Again, the longest heat sink fins 210 are along thecentral axis, and the length of the heat sink fins taper to the edges212 where they are shortest. This approach places the longest fins wherethey are needed most, and reduces the overall size and weight of thesatellite transmitter module compared to a satellite transmitter modulewith a rectangular cross section.

FIG. 5 shows another alternative embodiment, where the cross section isa rounded-corner rectangle. This end view figure shows that the heatsink 204 and its corresponding heat sink fins (210-212) haverounded-corner rectangular cross section, with the outer enclosure 201conforming to this rounded-corner shape. Again, the longest heat sinkfins 210 are along the central axis, and the length of the heat sinkfins taper to the edges 212 where they are shortest. As before, thisapproach places the longest fins where they are needed most, and reducesthe overall size and weight of the satellite transmitter module 200compared to a satellite transmitter module with a rectangular crosssection.

Finally, FIG. 6 shows yet another alternative embodiment, where thewhere the cross section is elliptical. This approach might be moresuitable for satellite transmitter modules 200 with a shorter but wideraspect ratio. This end view figure shows that the heat sink 204 and itscorresponding heat sink fins (210-212) an oblate or elliptical crosssection, with the outer enclosure 201 conforming to this ellipticalshape. Again, the longest heat sink fins 210 are along the central axis,and the length of the heat sink fins taper to the edges 212 where theyare shortest. As before, this approach places the longest fins wherethey are needed most, and reduces the overall size and weight of thesatellite transmitter module compared to a satellite transmitter modulewith a rectangular cross section. It is to be understood that othershapes of the enclosure 201 may be used as a complimentary element tothe heat sink fins 204 such that the heat sink fins 204 define thecontour of the shape of the enclosure 201.

As shown in FIG. 7, two different heat sinks may be used on the sameside of a transmitter unit, or alternatively, one heat sink may includetwo different heat sink fin regions of heat sink fins. As shown in FIG.7, for example, one heat sink fin region may include heat sink fins ofdifferent heights (210-212) to form a particular heat sink fin crosssection (e.g., rounded) while a second or another region may includeheat sink fins of the same height 213 to form a different heat sink fincross section (e.g., rectangular).

FIG. 8 demonstrates the more efficient heat dissipation capabilities ofthe tapering heat sink fins according to one embodiment of theinvention. In this example, FIG. 8a shows a gray-scaled heat mapcomparing the thermal performance of satellite transmitter modules withtwo different cross sections. FIG. 8a shows the thermal performance of amodule with a heat sink with a substantially circular cross section,like the one shown in FIG. 2. Only half of the structure is simulated,taking advantage of symmetry to reduce simulation times. In thisexample, the highest level of heat generated occurs in the central axisof the satellite transmitter unit, roughly one-quarter of the way alongthe length. Simulations indicate with proper air flow, the peaktemperature rise is 12.8 degrees C. Compare this to the performance inFIG. 8b , which illustrates a more conventional rectangular crosssection. In this example, the peak temperature rise is 12.3 degrees C.,which is a mere 0.5 degrees C. less than the rounded cross section usedin FIG. 8a . The weight reduction, however, is considerable. The roundedheat sink in FIG. 8a weighs 2.7 lbs, while the more conventionalrectangular heat sink shown in FIG. 8b weighs 3.3 lbs. The rounded crosssection heat sink weighs 18% less and performs essentially just as wellas the conventional rectangular cross section heat sink.

Alternatively, embodiments of the invention include a satellitetransmitter module for accepting input signals and emitting outputsignals for uplink transmission in a satellite communication system. Thesatellite transmitter module comprising a transmitter comprisingtransmitter circuitry for transmitting a suitable satellitecommunications signal. A heat sink thermally coupled to the transmitter,the heat sink includes two sets of heat sink fins. A first set of heatsink fins include fins with heights as a function of a distance betweenthe plurality of heat sink fins and the transmitter. A second set offins includes fins with a uniform height that is not affected by itsdistance to the transmitter. The two sets of heat sink fins arepositioned in a close proximity to the transmitter for dissipatingthermal energy generated from the transmitter. A fan, disposed at adistal end of the transmitter, generates air flow substantially parallelwith spaces between the heat sink fins. An outer enclosure encloses thetransmitter and the plurality of heat sink fins therein.

As a result reducing the height of some of the heat sink fins, thetransmitter module can be designed to weigh less and to be smaller.Because portable satellite communications transmitters are vitallyimportant in mobile newsgathering, military, etc. applications, theoverall size and weight are extremely important factors in theportability of the overall satellite transmitter system. Furthermore,because the size and weight of the transmitter module is much smallerthan conventional transmitters, the transmitter module may be mountedonto or into an integrated portable satellite communication system thatincludes a satellite dish, an upconverter, a modem, etc. Furthermore, insome embodiments the module may become a structural member of thetransmitter system, such as replacing the arm, mount, boom, etc. on atraditional dish. Moreover, because the enclosure of the transmittermodule may include a rounded cross section, the external aerodynamicsare more favorable to higher winds, etc. when the portable system isdeployed in the field. Additionally, the enclosure of the cross sectionmay be constructed of a solar reflective material, such as reflectiveplastics, metals, ceramics, glass, etc., that assists in lowering theoverall temperature of the transmitter module when out in the field.

In some further embodiments, a transceiver module may include a receivermodule coupled with the transmitter module. This receiver module mayreceive and may process incoming communication signals from a satellite.As a result, this “transceiver” (transmit and receive) module may allowa user to both send signals to and receive signals from a distantsatellite. The receiver module typically generates much less heat than atransmitter module and requires much less volume than the transmittermodule. All of the techniques and advantages described above regardingthe heat dissipation of the transmitter module also apply to receivermodule and transceiver modules as well.

Still further, the figures depict preferred embodiments of a satellitetransmitter system for purposes of illustration only. One skilled in theart will readily recognize from the foregoing discussion thatalternative embodiments of the structures and methods illustrated hereinmay be employed without departing from the principles described herein.Thus, upon reading this disclosure, those of skill in the art willappreciate still additional alternative structural and functionaldesigns for a system and a process for automatically extracting,transforming, and loading content data through the disclosed principlesherein.

Thus, while particular embodiments and applications have beenillustrated and described, it is to be understood that the disclosedembodiments are not limited to the precise construction and componentsdisclosed herein. Various modifications, changes and variations, whichwill be apparent to those skilled in the art, may be made in thearrangement, operation and details of the method and apparatus disclosedherein without departing from the spirit and scope defined in theappended claims.

1. An apparatus comprising: a transmitter unit comprising a transmittercircuitry; at least one heat sink coupled to the transmitter unit, theheat sink including a plurality of heat sink fins, wherein (i) at leasttwo of the heat sink fins are of different fin heights, (ii) the heatsink is positioned in a close proximity to the transmitter circuitry and(iii) the fin heights of the heat sink fins are a function of the closeproximity to the transmitter circuitry and amounts of heat from thetransmitter circuitry; a fan configured to generate an air flowsubstantially parallel with spaces between the heat sink fins; and anouter enclosure (i) enclosing the transmitter unit and the heat sinkfins therein, (ii) being impermeable to the air flow generated by thefan, and (iii) including a cross section shape substantially similar toa contour of the heat sink fins.
 2. The apparatus of claim 1, whereinthe cross section shape of the outer enclosure is substantially similarto a fan cross section shape defined by rotating blades of the fan. 3.The apparatus of claim 1, wherein the transmitter circuitry is situatedalong a central axis of the transmitter unit and in substantially a samedirection as the air flow from the fan.
 4. The apparatus of claim 3,wherein the height of one of the heat sink fins situated on the centralaxis of the transmitter unit is higher than the height of each other ofthe heat sink fins when a number of the heat sink fins is odd.
 5. Theapparatus claim 3, wherein the heights of two of the heat sink finssituated closest to the central axis of the transmitter unit are higherthan the heights of others of the heat sink fins when a number of theheat sink fins is even.
 6. The apparatus of claim 1, wherein (i) thetransmitter unit is coupled to another heat sink, and (ii) the anotherheat sink including another plurality of heat sink fins.
 7. Theapparatus of claim 1, wherein the heat sink fins are parallel to everyother of the heat sink fins.
 8. The apparatus of claim 1, wherein thecross section shape of the outer enclosure is a rounded shape.
 9. Theapparatus of claim 1, wherein the cross section shape of the enclosureis a polygonal shape.
 10. The apparatus of claim 1, wherein the crosssection shape of the outer enclosure is a circular shape or anelliptical shape.
 11. The apparatus of claim 1, wherein the heat sinkfins includes pin fins.
 12. The apparatus of claim 1, wherein thetransmitter circuitry includes a frequency converter unit configured tomodify an input frequency of an input signal to an output frequencysuitable to use in satellite communication.
 13. The apparatus of claim1, wherein the transmitter circuitry includes an amplifier unitconfigured to amplify an input power level of an input signal to anoutput power level suitable to use in satellite communication.
 14. Theapparatus of claim 1, wherein the transmitter circuitry further includesa receiver unit configured to convert an input satellite signal into anoutput data signal to be demodulated.
 15. An apparatus comprising: atransmitter comprising a transmitter circuitry configured to transmit asatellite communications signal; at least one heat sink thermallycoupled to the transmitter, the heat sink including a plurality of heatsink fins, wherein (i) at least two of the heat sink fins compriseheights as a function of a distance between the heat sink fins and thetransmitter, and (ii) the heat sink is positioned in a close proximityto the transmitter; a fan, disposed at a distal end of the transmitter,and configured to generate an air flow substantially parallel withspaces between the heat sink fins; and an outer enclosure enclosing thetransmitter and the heat sink fins therein.
 16. The apparatus of claim15, wherein a cross section shape of the outer enclosure issubstantially similar to a contour of the heat sink fins.
 17. Theapparatus of claim 16, wherein the cross section shape of the outerenclosure is substantially similar to a fan cross section shape definedby rotating blades of the fan.
 18. A method for reducing thermal energyin a transmitter comprising the steps of: connecting two sets of aplurality of heat sink fins to the transmitter, wherein (i) each of theheat sink fins includes a corresponding height, (ii) the heights of afirst set of the heat sink fins are determined as a function of distancebetween the heat sink fins and the transmitter and (iii) the heights ofa second set of heat sink fins are not determined as a function ofdistance between the heat sink fins and the transmitter; generating anair flow substantially parallel with spaces between the heat sink finsvia a fan; and enclosing the heat sink fins and the transmitter in ahousing.
 19. The method of claim 18, wherein (i) a first set of the heatsink fins have heights that are determined as a function of distancebetween the each of the heat sink fins and the transmitter and (ii) asecond set of the heat sink fins have heights that are not determined asa function of distance between the each of the heat sink fins and thetransmitter.
 20. The method of claim 18, wherein the housing comprisesat least one cross section shape among (i) circular, (ii) elliptical,(iii) rounded-corner, and (iv) polygonal.